Sputtering Target Bonding Products Piezo electric YSZ - (Y2O3 stabilized ZrO2
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USA
- USA
- CAN
- USA
- CAN
Ships within 48 hours · Estimated delivery Aug 18 - Aug 23
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Sputtering Target Bonding Products Piezo electric YSZ - (Y2O3 stabilized ZrO2Rectangular and Round Sputtering Target Bonding services offered. Backing plate designed and fabricated as per your specifications. Material: OFHC copper, Standard round Cu backing plate discs are 0. 125 in thickness. Backing plate diameter is 3 8" larger than Target diameter Available with Indium solder bonding for high thermal conductivity and cheaper Ag paste bonding Send us your CAD drawing for a quote Order with needed Sputter targets Price
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